VIA Announces VIA ARTiGO A630 Enterprise IoT Gateway System

November 15, 2017

VIA Announces VIA ARTiGO A630 Enterprise IoT Gateway System

Flexible space-saving design with rich connectivity options expands the VIA ARTiGO Series portfolio for wireless IoT gateway applications


Taipei, Taiwan, November 15, 2017 - VIA Technologies, Inc., today announced the launch of the VIA ARTiGO A630, an ultra-slim fanless gateway system with flexible customization options for a broad spectrum of commercial M2M and IoT applications.

Featuring a high-performance 1.0GHz VIA Cortex-A9 dual-core SoC, multiple network connectivity options, and a rich combination of I/O, the VIA ARTiGO A630 adds a cost-effective solution to the growing range of VIA Enterprise IoT gateway devices designed to manage the connection and control for a wide spectrum of connected HMI and automation applications.

“The VIA ARTiGO A630 bolsters our already diverse range of ARTiGO Series M2M and IoT gateway systems,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “Providing a rich mix of connectivity and performance in an ultra-compact design that can be rapidly customized, will help customers speed time-to-market and unlock the full potential of their IoT deployments.”


VIA ARTiGO A630 Enterprise IoT Gateway

Powered by a 1.0GHz VIA ARM Cortex-A9 dual-core SoC, the VIA ARTiGO A630 features a high-performance 2D/3D graphics and video engine that supports Open® GL ES 2.0 hardware acceleration and comes with an on-board Micro SD card slot, 4GB eMMC Flash memory, and 1GB DDR3 SDRAM. 

Measuring just 154.4mm x 27mm x 106.7mm (W x H x D), the VIA ARTiGO A630 offers a rich array of I/O and display expansion options, including one HDMI port, one RS-232/485 COM port, one DIO port with support for 8-bit GPIO, two USB 2.0 ports, one micro USB 2.0 port, one 10/100Mbps Ethernet port, and one miniPCIe slot. Optional Wi-Fi and 3G wireless modules are also available which can be supported through on-board USB pin-headers or the miniPCIe slot.

The ARTiGO A630 features an optimized Linux BSP (Kernel 3.4.5) supporting all key onboard hardware features to speed development, deployment and ease system management. A full set of software customization services that speed up time to market and minimize development costs is also available.

For more information about the VIA ARTiGO A630, please visit:[...]

For images related to this release, please visit:


About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.


VIA PR Contact


International: Richard Brown


Phone: (886)-2-2218-5452 #6201


Fax: (886)-2-8218-6752


Email: [email protected]