STMicroelectronics and Virscient Accelerate Connected-Car Systems with Telemaco3P Automotive Application Processors to Market
March 14, 2019
Virscient offering to provide wireless connectivity expertise to ST automotive customers for accelerated time-to-market of secure, connected products.
Nuremberg, Germany. STMicroelectronics partnered with Virscient to build automotive solutions using ST's Telemaco3P secure telematics and connectivity processors.
Virscient offers support based on the ST Modular Telematics Platform (MTP), which assists the quick prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles.
Virscient provides a background in wireless connectivity technologies and protocols conducive for architecting connected-car systems that depend on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.
The Telemaco3P employs dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and connectivity interfaces.
"We chose to collaborate with Virscient for Telemaco3P-based designs because of their differentiated expertise in the development of embedded systems and wireless technologies, and their proven track record of helping customers take connected products from concept to market," said Head of EMEA Marketing and Application for STMicroelectronics’ Automotive and Discrete products, Philippe Prats. "The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics. By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies."