ProPlus and MPI Partner, Announce Characterization and Modeling Solution
December 12, 2017
Cross-Licensing Agreement Brings Next-Level Wafer-Level Noise Characterization, Enabling High Throughput Measurements with Advanced Probing Technologies
ProPlus Design Solutions and MPI announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus’ SPICE modeling and noise characterization solution with MPI’s advanced probing technologies.
The integrated solution offers seamless support of the MPI probe stations to perform automated measurement of DC, CV and noise characteristics, enabling MPI users easy access to the most accurate ProPlus SPICE modeling and noise characterization offerings. The advanced probing technologies developed by MPI are optimized for the latest ProPlus 9812DX noise analyzer with improved grounding and shielding technologies critical to wafer-level noise characterization.
Under the partnership agreement, ProPlus users are able to integrate MPI’s advanced semi-automatic probe stations in their characterization and modeling flow for better noise measurement quality. The close collaboration also proved that probe card wafer-level noise characterization is possible using the 9812DX noise analyzer. Previously, these measurements were performed using manipulators and easily introducing RF interferences and oscillations. The advanced probe card technology specially developed for noise measurement provides better data quality and stability, as well as improves flexibility of wafer-level noise characterization for higher throughput.
The integrated solution has been adopted by leading semiconductor companies. ProPlus and MPI Corporation will demonstrate the joint solution globally throughout 2018. Interested users can request a demo at either ProPlus lab in San Jose, Calif., or the MPI lab in Taiwan. Pricing is available upon request.