Dev Kit Weekly ??Electric Imp C001 Cellular Breakout Kit

April 30, 2019

Dev Kit Weekly ??Electric Imp C001 Cellular Breakout Kit

The certified C001 module on the board supports LTE Category 1 and 3G HSPA operation over AT&T, T-Mobile and Verizon networks, as well as concurrent cellular, 10/100 Ethernet and Wi-Fi connectivity.

Join Embedded Computing Design's Editor-in-Chief Brandon Lewis as he reviews the latest electronic development kits in less than five minutes. 
 
This episode, Brandon gives a high level overview of the C001 Cellular Breakout Kit from managed IoT solution provider Electric Imp. The certified C001 module on the carrier board supports LTE Category 1 and 3G HSPA operation over AT&T, T-Mobile, and Verizon networks, as well as concurrent cellular, 10/100 Ethernet, and Wi-Fi connections. The board is also outfitted with a Mikrobus socket and two Grove connectors, making it a great starting point for IoT engineers looking to prototype wide-area network designs. 
 
Of course, a Taoglas antenna is included so you can start communicating with Electric Imp's Managed Cloud out of the shoot, and test over-the-air (OTA) updates to the onboard Arm Cortex-M7.
 
The Imp C001 Cellular Breakout Kit retails for $129, while the module will set you back $85. But, as always, you can win it for free by entering the raffle below.

Questions for @techielew about the kit? Leave a comment. Or, take a deeper dive on the Imp C001 by visiting https://store.electricimp.com/collections/impcellular/products/impc001-breakout-board-kit-preorder?variant=7599263973399.
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