Dev Kit Weekly ??Electric Imp C001 Cellular Breakout Kit
April 30, 2019
The certified C001 module on the board supports LTE Category 1 and 3G HSPA operation over AT&T, T-Mobile and Verizon networks, as well as concurrent cellular, 10/100 Ethernet and Wi-Fi connectivity.
Join Embedded Computing Design's Editor-in-Chief Brandon Lewis as he reviews the latest electronic development kits in less than five minutes.
This episode, Brandon gives a high level overview of the C001 Cellular Breakout Kit from managed IoT solution provider Electric Imp. The certified C001 module on the carrier board supports LTE Category 1 and 3G HSPA operation over AT&T, T-Mobile, and Verizon networks, as well as concurrent cellular, 10/100 Ethernet, and Wi-Fi connections. The board is also outfitted with a Mikrobus socket and two Grove connectors, making it a great starting point for IoT engineers looking to prototype wide-area network designs.
Of course, a Taoglas antenna is included so you can start communicating with Electric Imp's Managed Cloud out of the shoot, and test over-the-air (OTA) updates to the onboard Arm Cortex-M7.
The Imp C001 Cellular Breakout Kit retails for $129, while the module will set you back $85. But, as always, you can win it for free by entering the raffle below.
Questions for @techielew about the kit? Leave a comment. Or, take a deeper dive on the Imp C001 by visiting https://store.electricimp.com/collections/impcellular/products/impc001-breakout-board-kit-preorder?variant=7599263973399.