Pixus Announces New 9U RiCool OpenVPX Chassis with Front-to-Rear Cooling
January 15, 2018
Pixus Technologies offers over 392 cubic feet per minute of airflow in the 9U RiCool, a front-to-rear cooled rackmount chassis platform.
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers over 392 cubic feet per minute of airflow in the 9U RiCool, a front-to-rear cooled rackmount chassis platform. The chassis platform features up to 32 OpenVPX backplane slots in the 3U size and up to 16 slots accommodating 6U cards. Reverse impeller blowers directly above the boards pull air from below the card cage and blow the exhaust 90 degrees out the back. This allows the use of rear transition modules without adding chassis height. The fans are individually hot swappable, enhancing reliability and minimizing downtime.
The Pixus RiCool chassis platforms feature various power supply options, including fixed, pluggable and redundant options. The OpenVPX versions come in PCIe Gen3 or 40GbE speeds and beyond. OpenVPX shelf managers and VITA 62 power interface boards are optional.
Pixus provides OpenVPX chassis platforms in various front-to-rear, side-to-side, and bottom-to-top airflow configurations. The company also offers system platforms in CompactPCI Serial, MicroTCA, AdvancedTCA, VME64x and customized architectures.